商品編號: DVD12453
  商品名稱: DynaForm 5.9.4-用於板料成形數值模擬的專用軟件
  光碟片數: 1片
  銷售價格: $100元
您可能感興趣: Engineer 
DVD12366--Eziriz .NET Reactor代碼保護和軟件防盜版工具
DVD12225--教程-Skillshare – After Effects for Graphic Design
DVD12388--教程-MEVP Stack Vue JS 2 Course: MySQL + Express.js + Vue.js +PHP
DVD12086--BackUp Maker Professional Edition 7.304 Multilingual-文件備份還原工具
DVD12155--Blue Cat’s All Plug-Ins Pack 2019.1-Blue Cat’s系列插件合集
DynaForm 5.9.4-用於板料成形數值模擬的專用軟件

Dynaform 軟件基於有限元方法建立, 被用於模擬鈑金成形工藝。Dynaform軟件包含BSE、DFE、Formability三個大模塊,幾乎涵蓋沖壓模模面設計的所有要素,包括:定最佳沖壓方向、坯料的設計、工藝補充面的設計、拉延筋的設計、凸凹模圓角設計、沖壓速度的設置、壓邊力的設計、摩擦係數、切邊線的求解、壓力機噸位等。

Engineering Technology Associates, Inc. (ETA) announced the release of DYNAFORM Version 5.9. In the new version, a brand new module, incorporating optimization, has been unveiled. The Optimization Platform (OP) makes DYNAFORM the most complete and powerful solution on the market for die system simulation and optimization.

DynaForm 5.9
ETA has embedded Red Cedar’s proprietary optimization technology, SHERPA, into the OP module. The module is focused on supporting optimization of drawbead forces along with binder pressure, lubrication, gage, and material.

DynaForm 5.9
Using the newest optimization technology, the OP module reduces product development time and cost for manufacturing by reducing incidents of wrinkling, thinning and tearing with limited effort. The OP guided user interface makes optimization viable for a larger set of users, since special optimization expertise is not required. Additionally, the latest computing platforms combined with an efficient solver eliminate demanding computing requirements. The solver is an incremental solution (INCSolver) that delivers exceptional speed, taking advantage of Shared Memory Processing (SMP) computing technology on multiple core machines running Windows 7 and beyond.

ETA Dynaform 5.9.3
The OP module will use the same common interface as the other four modules of DYNAFORM that include Blank Size Engineering (BSE), Die Face Engineering (DFE), Formability Simulation (FS), and Die System Analysis (DSA). Each of the four previously available modules has also been enhanced in the Version 5.9 software release.

Complete DYNAFORM Version 5.9 Release Notes, are now available online at DYNAFORM59Release

About Engineering Technology Associates, Inc. 

Engineering Technology Associates, Inc. (ETA) was established in 1983 by advanced product development Engineers working as structural analysts for the world’s largest automotive manufacturers. ETA’s expertise in the areas of vehicle durability, NVH, metal forming, crashworthiness, occupant safety and product design have provided an intimate knowledge of the challenges and needs of the product development Engineer. Proactive in the creation and implementation of new analysis methods and software, ETA is the developer of the Inventium Suite, an enterprise product development solution that includes DYNAFORM.

Name: Dynaform
Version: 5.x
Interface: english
OS: Windows XP / Vista / Seven