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Cadence Clarity 2019 v19.00.000 3D電磁(EM)仿真軟件工具
Cadence公司宣佈了發佈Cadence® Clarity 3D Solver。這是Cadence公司系統級分析策略下推出的第一款產品,突破性的電磁場(EM)仿真技術可提供10倍的性能、無限容量,以及黃金標準的仿真精度。

這一突破性的性能是如何實現的?本文將著重討論其在雲端的應用。

儘管使用終端數據中心也可以實現相同的可擴展性,但是為了大量加載的數據中心而獲取數十台服務器總是個不小的挑戰。在Clarity 3D Solver之前,Cadence已宣佈推出CloudBurst  平台,它支持功能驗證、電路仿真、庫特性和驗收工具,同時也支持Clarity。

3D EM仿真

隨著數據速率的提高,精準的3D EM仿真變得越來越重要。去年,Cadence宣佈了112G長距離SerDes IP。該IP位於7nm芯片上,擁有一個相當良好的控制環境。但是仔細想想信號的工作流程就會發現:信號從芯片上的IP開始,通過封裝到一個板上,再通過連接器進入背板,接著第二個連接器、第二塊板、第二個封裝,最後進入不同芯片上的接收器。當然,我們可以將所有這些簡化為一個單個脈衝響應以完成信號完整性分析(詳見文章 “DesignCon:Cadence與IBM聯手講授高級IBIS-AMI技術” ),但是為了使脈衝響應準確,封裝、PCB走線、連接器和電纜的所有結構都需要精確建模;尤其對於擁有高度複雜機械結構的連接器而言更是如此。

汽車是另一個需要提高精確度的領域。現代汽車有很多ECU(電子控制單元),在某些情況下超過100個。其中許多都只具有相對較低的性能——調整座椅或調高娛樂系統的音量,這些都不需要兆位數據或毫秒延遲。但ADAS(高級駕駛輔助系統)確有此方面的需要:照相機、雷達和激光雷達都會產生大量數據,而自動駕駛則需要低延遲。例如,AEB(自動緊急制動)是一場剎車功能和事故發生之間的競賽——在60英里/小時的速度下,英吋級長度和毫秒級時間的結果要進行考量。舊的汽車總線,如CANbus,缺少相應的功能特性,因此當今的汽車開始越來越多的使用以太網。數據速率將會不斷提高,通過雙絞線銅纜運行的千兆汽車以太網也將成為標準配置。為了實現在嘈雜的汽車環境中正常工作,我們需要對線束和連接器進行準確分析。

Clarity

對於最極端的情況,例如沒有誤差餘地的112G長距離傳輸,我們需要真正的整體的3D分析。但是目前的3D建模工具並未跟上設計團隊的要求——無法保證模型運算結果的精確度。EDA中的分析工具一般開始都是只能進行點分析的工具,但設計團隊真正需要的是實現分析與構建的集成。隨著Cadence雲端的發布,計算基礎設施在去年發生了改變,不再需要大型的、專用的、昂貴的服務器。

Clarity提供新一代的真正整體的3D解決方案:

黃金標準的精確性
世界級並行處理技術
高達10倍的性能提升
與Cadence工具的集成
接受CloudBurst平台支持
在分析112G連接器-PCB接口時,與40個CPU上傳統場求解器的基本情況相比,使用了數百個CPU的Clarity 3D Solver的分析速度提高了12.3倍(見右圖)。在汽車DDR4接口的測試案例中,則實現了10.4倍的加速。

Clarity 3D Solver與Sigrity 驗收分析流程協同工作,為最具挑戰的情況——如112G長距離接口,提供驗收分析。對於分析工具而言,最重要的是分析結果是否與現實情況相符。下方眼圖顯示了使用Clarity和Sigrity(右側淺藍色)工具仿真結果與實際測量值(左側粉紅色)的對比,幾乎毫無二致。

Teradyne 泰瑞達

泰瑞達半導體測試事業部的工程副總裁Rick Burns表示:

“對於傳輸速度超過千兆位以及高層數(大於30層)、高密度的PCB,我們依靠對複雜結構的精確互連模型提取來支持信號完整性分析。使用Cadence Clarity 3D Solver,我們只需花費曾經的一小部分時間即可達到所需精度。這為我們開闢了一個分析仿真的新時代,因為我們現在可以在之前運行一次模擬的時間裡運行數十次模擬。這減少了重複設計,並幫助我們實現對客戶的承諾——以最低的測試成本為客戶提供最高的產出。”

Cadence Clarity 2019 version 19.00.000 | 
Cadence Design Systems, Inc. entered the fast-growing system analysis and design market with the announcement of the Cadence Clarity 3D Solver, which delivers gold-standard accuracy with up to 10X faster simulation performance and unbounded capacity compared to legacy field solver technology.

Harnessing state-of-the-art distributed multiprocessing technology, the Clarity 3D Solver efficiently tackles electromagnetic (EM) challenges encountered when designing complex 3D structures on chips, packages, PCBs, connectors and cables—bringing true 3D analysis to any Engineer with desktop, high-performance computing (HPC) or cloud computing resources. The Clarity 3D Solver easily reads design data from all standard chip, IC package and PCB implementation platforms while also providing unique integration benefits for design teams using the Cadence Allegro and Virtuoso implementation platforms.

Highly complex structures found in silicon interposers, rigid-flex PCBs and stacked-die IC packages must be modeled accurately in 3D for structure optimization and high-speed signaling compliance. High-speed signaling, such as in 112G serializer/deserializer (SerDes) interfaces, relies on high-fidelity interconnect design. Any slight change in impedance can negatively impact bit error rate, so optimization entails extensive research including dozens of complex extractions and simulations. To accommodate this workload, legacy field solvers must run on massive, expensive high-performance servers. In addition, speed and capacity limitations of legacy field solver technology require users to carefully simplify and/or partition the structure into smaller segments to fit within local computing constraints. This pseudo-3D approach creates the risk that the resulting final model may contain inaccuracies due to artificial effects from the superficial model boundaries.

Clarity 3D Solver technology addresses the most complex EM challenges faced when designing systems for 5G communications, automotive/ADAS, HPC and IoT applications. Industry-leading Cadence distributed multiprocessing technology enables the Clarity 3D Solver to deliver virtually unlimited capacity and a 10X speed up required to efficiently and effectively address these larger and more complex structures. The Clarity 3D Solver creates highly accurate S-parameter models for use in signal integrity (SI), power integrity (PI) and electromagnetic compatibility (EMC) analysis, enabling simulation results that match lab measurement.

The Clarity 3D Solver is optimized to distribute a job across multiple low-cost computers while remaining equally efficient when running on a more powerful and expensive server with terabytes of memory. A unique distributed adaptive meshing approach and significantly smaller memory requirements than legacy 3D field solvers enable the Clarity 3D Solver to extensively utilize cost-effective cloud and on-premises distributed computing. These advantages make the cloud-ready Clarity 3D Solver an ideal choice to optimize a company’s cloud computing budget.

Using the Clarity 3D Solver in conjunction with the Cadence Sigrity 3D Workbench, users can merge mechanical structures such as cables and connectors with their system design and model the electrical-mechanical interconnect as a single model. The Clarity 3D Solver is also tightly integrated with the Virtuoso, Cadence SiP Layout and Allegro implementation platforms, enabling 3D structures to be designed in the Allegro and Virtuoso environments, optimized in the analysis tool and implemented in the design tool without being redrawn.

New Products 
Added In this release, the following new products have been added:

Product: Cadence Clarity
Version: 2019 version 19.00.000
Supported Architectures: x64
Website Home Page : http://www.cadence.com
Language: english
System Requirements: PC *
Supported Operating Systems: *

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